Télécharger le livre :  Managing More-than-Moore Integration Technology Development
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This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program – but using a novelized form. The material is presented in a conversational format through a story that follows a fictional...

Editeur : Springer
Parution : 2018-07-20

PDF, ePub

34,80
Télécharger le livre :  More-than-Moore 2.5D and 3D SiP Integration
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This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration...

Editeur : Springer
Parution : 2017-02-08

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89,66
Télécharger le livre :  Three Dimensional System Integration
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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in...

Editeur : Springer
Parution : 2010-12-07

ePub

52,74